The SIFAM Photonic Packaging unit provides an advanced design and manufacturing service for photonic and microelectronic customers in the military, aerospace, medical, communications and industrial markets. A purpose built ISO9001 qualified facility in the UK provides an exceptionally comprehensive range of packaging processes in an anti static clean room environment.

Our packaging team provide a full design, modelling and support service for R&D samples through to volume manufacture. A variety of custom optoelectronic sources receivers and components have been developed with wavelengths ranging from 405nm through to 3um for free space, connector receptacle, or pigtailed with multimode (MM), singlemode (SM) or polarisation maintaining (PM) fibre using standard and custom package styles. Standard package styles include hermetically sealed cooled and uncooled butterfly packages, high heat-load packages (HHL) and a wide range of TO and CD packages.